With the development of integrated circuits towards high performance, miniaturization and high integration, three-dimensional packaging technology has become a mainstream trend in…
With the development of integrated circuits to high density, miniaturization and high performance, 3D packaging technology has become an important direction in…
Molybdenum-copper alloy is a metal composite material with high thermal conductivity and low coefficient of thermal expansion, which is widely used in…
With the development of electronic devices in the direction of miniaturization, high integration and high power density, the thermal management capability of…
As a high-performance electronic packaging material, molybdenum-copper alloy (MoCu) surface treatment technology plays a decisive role in improving the reliability and service…
With the continuous development of integrated circuit technology, the traditional two-dimensional planar packaging method has been difficult to meet the packaging requirements…
In practice, the hermeticity and long-term reliability of molybdenum-copper packages still face many challenges, especially in extreme environments (e.g., vacuum, high temperature,…
The manufacture of ultra-thin molybdenum copper heat sinks must not only maintain the compactness and uniformity of the alloy, but also meet…
Molybdenum-copper alloy is widely used in key components such as packaging heat sinks, substrates and heat sinks for high-power semiconductor devices. However,…
With the rapid development of semiconductor devices in the direction of high power, high frequency and high integration, the heat generated during…